SK Hynix to Build $13 Billion AI Memory Chip Packaging Plant

SK Hynix Inc. plans to spend 19 trillion won ($12.9 billion) building a new advanced chip packaging facility, kicking off a major expansion aimed at meeting surging demand from AI applications.

The South Korean company will begin construction of the complex in the southern city of Cheongju in April with the aim of completion by the end of 2027, according to a statement on the chipmaker’s website. SK Hynix is the world’s leading supplier of high-bandwidth memory for Nvidia Corp.’s AI accelerators.